Electrostatic chuck and method of attracting wafer
US5777838A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1996 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Nov 20, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck including an electrode having first and second surfaces, a dielectric member having a first layer for covering at least the first surface of the electrode, a power supply for conducting electric power to the electrode, and a cooling gas-feeding means for feeding a cooling gas onto the surface of the first layer of the dielectric member. A plurality of fine projections 28 are formed on the surface of the first layer of the dielectric member. Each of the fine projections 28 has a tip smaller than a root thereof so as to hold a wafer W in substantially a point-contact manner. The wafer can be held on the surface of the first layer of the dielectric member and cooled by the cooling gas fed from the cooling gas-feeding means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.