Method for surface mounting a heatsink to a printed circuit board
US5779134A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1996 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Oct 31, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A low cost method for attaching a heat slug to a printed circuit board using surface-mount technology. In one embodiment a metal coating is deposited about the periphery of an opening of a printed circuit board. Solder paste is then applied over the metal coating. The heat slug is then installed into the opening of the printed circuit board using a standard pick-and-place surface-mount machine. When installed, the ledge of the heat slug rests atop the previously deposited solder. The connection between the printed circuit board and heat slug is made by running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the PCB and onto the heat slug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.