Patent · US Expired

Thermoplastic molding materials based on partly aromatic poly-amides and polyetherimides

US5780576A · kind A · utility

10Cited by

6References

7Claims

0Family size

Assignee

BASF SE

Inventors

Martin Weber · Maikammer, DE
Herbert Fisch · Monsheim, DE
Gunter Pipper · Bad Dürkheim, DE
Axel Gottschalk · Neustadt, DE

Key dates

Filing date	Apr 12, 1996
Grant date	Jul 14, 1998
Priority date	—
Expiry date	Apr 12, 2016

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31721
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding materials contain PA1 A) from 1 to 99% by weight of a partly aromatic copolyamide composed of PA2 a.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid, PA2 a.sub.2) from 6 to 25 mol % of units which are derived from isophthalic acid, PA2 a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine and PA2 a.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms, the molar percentages of components a.sub.1) to a.sub.4) together giving 100%, PA1 B) from 1 to 99% by weight of a polyetherimide, PA1 C) from 0 to 30% by weight of a polymeric component having OH groups, PA1 D) from 0 to 60% by weight of fibrous or particulate fillers or mixtures thereof, PA1 E) from 0 to 40% by weight of rubber impact modifiers and PA1 F) from 0 to 40% by weight of conventional additives and processing assistants.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.