Semiconductor device and a process of manufacturing the same
US5780870A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided for convenient checking of etching states of semiconductor layers, along with a process for its preparation, wherein a test layer is formed on the same wafer where a semiconductor product is manufactured, and concurrently with and under the same formation conditions as formation a target layer forming a part of the semiconductor product, wherein the test layer is formed on a first layer and on a second layer interposed between a portion of the test layer and the first layer, with one of the first and second layers having the same etching properties as the target layer and the other of the first and second layers having different etching characteristics from the target layer. After etching the test layer and target layer concurrently to form holes in each the amount of the etching of the holes can be measured by an electron microscope, and the amount of etching in the target layer of the semiconductor product is controlled from the state of the etching reaching to the lower layer, either the first or second layer, below the test layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.