Laser manicure process
US5782249A · kind A · utility
71Cited by
7References
16Claims
0Family size
Inventors
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2018/00452
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
There is provided an improved process and apparatus for cutting and/or fingernails. The process includes the step of providing laser radiation to cut or score the nails, and optionally cooling the site of administration of the laser beam. The nails can be coated with colored lacquers to provide a multicolored design when melted by the laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.