Covered microchannels and the microfabrication thereof
US5783452A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1996 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Feb 2, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0035
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is a covered microchannel comprising: a) a substrate; b) an etched material adhered to the substrate; and c) a silicon-carbon material adhered to the etched material in such a manner to form a covered microchannel; wherein the silicon-carbon material comprises SiO.sub.1.8-2.4 C.sub.0.3-1.0 and H.sub.0.7-4.0 containing at least one of the following functional groups: EQU --Si--O--Si--, --Si--CH.sub.2 --, --Si--H, or --Si--OH. The covered microchannel can be prepared by the steps of: a) coating a filler material onto a substrate having a groove, wherein the filler material covering the substrate fills the groove; b) removing filler material from the substrate but not from the groove; c) coating the substrate and the filler with an adhering, formable, capping material; and d) removing the filler from the groove. An etched laminate can also be used to prepare the covered microchannel. The present invention provides a covered microchannel that can be prepared under milder conditions than those previously contemplated, thereby allowing greater flexibility in the choice of material of the substrate. The covered microchannel can be used, for example, in micro-liquid o…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.