Compliant bump technology
US5783465A · kind A · utility
62Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1997 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Apr 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The specification describes an interconnection technique using compliant metal coated photodefined polymer bumps for mounting and interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The polymer chosen for the bump structure has a relatively low T.sub.g and the polymer bump is metallized in a way that substantially encapsulates the polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.