Mold removal composition and mold bleaching method
US5783550A · kind A · utility
7Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1997 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Jul 2, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/14
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A mold removal composition useful to remove molds adhered to furnishing and walls of homes, particularly kitchen sinks and bathroom walls, ceilings, and tiles, and a mold bleaching method are provided. The mold removal composition contains peroxide, dicyandiamide, alkali metal hydroxide or alkaline-earth metal hydroxide, and water. Its pH is 8.0-13.0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.