Sputter-resistant, low-work-function, conductive coatings for cathode electrodes in DC plasma addressing structure
US5783906A · kind A · utility
18Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1997 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Jun 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2217/4025
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A refractory compound coating (188) for electrodes is sputter resistant, has a low work function so that it is a good emitter of secondary electrons, is very resistant to oxidation, and is easy to apply by way of electrophoresis. More specifically, cathode electrodes (162) are used in a plasma addressing structure (10). The coating is preferably formed by electrophoretic deposition of particles (184) of at least one refractory compound along with a frit. The coating is subsequently baked to fuse the frit and bond the electrophoretically deposited particles to the electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.