Microchip module assemblies
US5784261A · kind A · utility
32Cited by
3References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 31, 1996 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Jan 31, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Low profile microchip module assemblies are formed by first mounting one or more active semiconductor integrated circuit chips on a multilayer metallization and dielectric structure on a substrate of, say, silicon or alumina, by wire bonding or flip-chip solder bonding, and then inverting the substrate and mounting it on a printed circuit board by means of solder bump connections. The solder bump connections are sufficiently high for the chips to be held clear of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.