Patent · US Expired

Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate

US5784779A · kind A · utility

1Cited by

5References

7Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Werner Gruenwald · Gerlingen, DE
Ralf Haug · Leonberg, DE
Martin Seyffert · Pfullingen, DE
Frank Hauschild · Berlin, DE

Key dates

Filing date	Oct 22, 1996
Grant date	Jul 28, 1998
Priority date	—
Expiry date	Oct 22, 2016

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49144
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for joining an electrical connection (10) of a non-packaged IC component (15) with a conductive strip (35) on a substrate (30). An easy to metallize layer (20) preferably is applied to the surface of an electrical connection (10) that is to be connected. The surface (10, 20) to be connected of connection (10) is arranged at a distance to and facing a contact surface (45) of a conductive strip (35) on a substrate (30). An electrically conductive material (50) for filling in the free volume between the two surfaces (10, 20; 45) to be connected is applied simultaneously to the contact surface (45) and the surface (10, 20) to be connected.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.