Fan assisted heat sink device
US5785116A · kind A · utility
63Cited by
41References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 1, 1996 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Feb 1, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fan assisted heat sink cooling device is disclosed in which the heat sink assembly also forms the housing surrounding the fan. The housing is constructed of a plurality of cooling vanes which have elongated openings therebetween allowing air to pass between and cool the vanes. The vanes are angled in an approximately opposite manner to the orientation of the fan blades in order to minimize the noise generated by the cooling device when in operation. The cooling device operates in an extremely efficient manner by causing air to pass over the cooling vanes twice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.