Frangible semiconductor wafer dicing apparatus which employs scribing and breaking
US5785225A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 29, 1996 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Feb 29, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/329
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A breaking device for separating a substrate along a scribe line formed in a surface of the substrate and spaced a predetermined distance D from a previously formed scribe line. The breaking device comprises a body member and a pair of laterally spaced annular profile members carried by the body member, the profile members each having a wall structure terminating in the contact surface. The amount of lateral spacing between the profile members is substantially equal to ND, where N is an integer, so that the contact surfaces of the pair of profile members are arranged for surface contact with a substrate on opposite sides of the scribe line, with one of the contact surfaces positioned adjacent the previously formed scribe line. An alternate embodiment includes an additional profile member carried by the body member and positioned between the pair of profile members to provide either equidistant positioning or offset positioning of the contact surface of the additional profile member with respect to the scribe line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.