Method of surface-contacting electronic components

US5785234A · kind A · utility

Assignee

• Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US

Inventors

• Stefan Weiss · Trostberg, DE
• Elke Zakel · Falkensee, DE

Key dates

• Filing date: Mar 29, 1996
• Grant date: Jul 28, 1998
• Expiry date: Mar 29, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/3489
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method of joining an electronic component (10) provided with contact surfaces (12) to a substrate (11) comprising contact surfaces (14) via contact metal coatings (16, 17) formed between the contact surfaces and made of a solderable or weldable joining material (15), the electronic component and the substrate being pressed together and heated, and during the joining operation a layer (18) of a medium (19) containing a polyalcohol is disposed at least between the joining material (15) and the contact surfaces (12) of the electronic component (10) or the substrate (11).