Adhesive for semiconductor devices and adhesive tape using the adhesive
US5786055A · kind A · utility
2Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1995 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Feb 1, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive for semiconductor device, comprising (a) a polyamide resin having an amine value of 20 to 60 and a weight average molecular weight of 1,000 to 5,000 and (b) a phenolic compound having a weight average molecular weight of 2,000 or less and having a skeleton containing at least 2 methylol groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.