Fungal inoculum preparation

US5786188A · kind A · utility

Assignee

• The United States of America, as represented by the Secretary of Agriculture · US

Inventors

• Richard T. Lamar · Madison, US
• Domen Lestan · Madison, US
• Christine E. Smith · New Garden Township, US
• Diane Dietrich · Old Bridge, US

Key dates

• Filing date: Jun 5, 1996
• Grant date: Jul 28, 1998
• Expiry date: Jun 5, 2016

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S435/911
• WIPO field: Biotechnology
• WIPO sector: Chemistry

Abstract

A fungal inoculum for bioaugmentation of soils contaminated with hazardous compounds or spawn for use in the edible mushroom industry is disclosed. A mechanically pelleted substrate that contains both structural and nutritive components forms the core of the fungal inoculum. The pelleted substrate core is coated with a hydrophilic material in which fungal propagules are dispersed. The biological potential of the fungal inocula can be enhanced by formulating the material composition of fungal inocula to meet the specific requirements of a particular fungus.