Laminated multilayer substrates
US5786238A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 1997 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Feb 13, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process of laminating a large-layer-count (LLC) substrates includes formation of first and second vias through respective substrates. A conductive path is formed through each of the respective vias, and posts are formed on the respective vias, electrically connected to the respective conductive path. A non-flowable adhesive layer having an aperture is provided between the LLC substrates so that the posts confront each other through the aperture. The LLC substrates are pressed together through the non-flowable adhesive layer to mechanically bond them together, and so that the posts abut each other. Simultaneously, the posts are electrically bonded to each other in the aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.