Hot melt adhesive having improved wet strength
US5786418A · kind A · utility
35Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1996 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Jul 3, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt adhesive is described which possesses superior properties for the construction of disposal soft articles and more specifically disposable soft articles which may be exposed to moisture for prolonged periods of time. The adhesive composition includes about 10% to about 60% by weight of a butene-1-ethylene copolymer; about 20% to about 80% by weight of a tackifying resin; about 5% to about 30% by weight of a plasticizer; and about 0.1% to about 3% by weight of an antioxidant, wherein the ingredients total 100%, by weight, of the entire adhesive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.