Low solvent composition of alicyclic epoxy oligomer
US5786435A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1997 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Sep 10, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D1/002
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a low solvent content-type resin composition, a low solvent content-type coating composition containing such a resin composition as a binder, and a method for coating such a coating composition. The resin composition comprises an oligomer containing an alicyclic epoxy group in a molecule and having a number average molecular weight (Mn) of 300 to 2000, a weight average molecular weight (Mw) of 300 to 4000 and an Mw/Mn ratio of 1 to 2.5. The coating composition comprises such a resin composition and a cationic polymerization catalyst, wherein the content of an organic solvent content is 0 to 40 wt. %. Since the present composition contains a low molecular weight oligomer, the viscosity of the composition is low even though the solid content is high. Accordingly, the content of the organic solvent can be much reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.