3-dimensional micromachining with femtosecond laser pulses
US5786560A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1997 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Jun 13, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C23/0025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of treating a material by generating an ultraviolet wavelength laser beam having femtosecond pulses; splitting the ultraviolet wavelength laser beam into a plurality of separate laser beams having femtosecond pulses; directing the separate laser beams onto a target point within a sample such that the femtosecond pulses of the separate beams overlap to create an intensity sufficient to treat the sample. Apparatus for treating a material that includes an ultraviolet laser for generating an ultraviolet wavelength laser beam having femtosecond pulse and directing that ultraviolet wavelength laser beam onto a beam splitter; a beam splitter for splitting the ultraviolet wave length laser beam into a plurality of separate laser beams having femtosecond pulses; directing the separate laser beams onto a target point within a sample such that the femtosecond pulses of the separate beams overlap to create an intensity sufficient to treat the sample.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.