Electroplating process
US5788830A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1996 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Aug 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/427
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for electroplating a surface comprising copper and an insulating material, comprising: applying specific carbon particles or a palladium compound to this surface, microetching the copper to remove the specific carbon particles or the palladium compound, and providing electroplating. The process is characterized by using an aqueous solution comprising 5 to 60 wt % of sulfuric acid, 3 to 35 wt % of hydrogen peroxide, 0.01 to 10 wt % of a phosphonic group-containing amine or a salt thereof, and, optionally, 0.1 to 10 wt % of an amine other than the phosphonic group-containing amine, as a microetching agent. This process can ensure highly reliable electroplating to inner walls of printing wiring board through-holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.