Method of producing circuit board
US5788855A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 23, 1997 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Jun 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board having a selectable circuit routing configuration comprises a substrate, a plurality of electrical traces mounted to the substrate for interconnecting electrical components, and at least one fusible connector mounted to the substrate. Each of the fusible connectors has a fuse line formed from a conductive layer of the printed circuit board and forms a fusible connection between at least two of the electrical traces. The circuit routing configuration can be selected by application of a predetermined current through at least one of the fusible connectors to break the fusible connection formed by the fusible connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.