Method of chemically depositing material onto a substrate
US5789027A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1996 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Nov 12, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2401/90
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods are described for depositing a film of material on the surface of a substrate by i) dissolving a precursor of the material into a supercritical or near-supercritical solvent to form a supercritical or near-supercritical solution; ii) exposing the substrate to the solution, under conditions at which the precursor is stable in the solution; and iii) mixing a reaction reagent into the solution under conditions that initiate a chemical reaction involving the precursor, thereby depositing the material onto the solid substrate, while maintaining supercritical or near-supercritical conditions. The invention also includes similar methods for depositing material particles into porous solids, and films of materials on substrates or porous solids having material particles deposited in them.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.