Method of separating electronic devices contained in a carrier
US5789307A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 1997 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Feb 7, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of separating electronic devices contained in a carrier which are provided at the surface of the carrier and are covered by a protective layer. Openings are provided above separation regions between adjacent electronic devices. The material of the carrier is removed in the separation regions starting from the openings, and the electronic devices are, at least during the material-removing process, confined in the carrier by respective regions with a material removal property different from that of the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.