Coating electronic substrates with silica derived from polycarbosilane
US5789325A · kind A · utility
26Cited by
14References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1996 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Apr 29, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A silica-containing coating is formed on an electronic substrate by applying a polycarbosilane on the substrate and converting it to a silica-containing material by heating in an oxidizing environment. The resultant thick planarizing coatings are useful as protective coatings and dielectric inner layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.