Epoxy resin with anhydride, toughener and active hydrogen-containing compound
US5789482A · kind A · utility
25Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1992 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Sep 28, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/4284
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Epoxy resin compositions which contain PA1 a) at least one epoxy resin containing, on average, more than one 1,2-epoxy group per molecule, PA1 b) an anhydride hardener for the epoxy resin a), PA1 c) a toughener, and PA1 d) a compound containing two active hydrogen atoms which is capable of reacting with the epoxy resin a) have an outstanding toughness and are suitable as casting resins, laminating resins, moulding compounds, coating compounds and encapsulation systems for electrical and electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.