Led array with stacked driver circuits and methods of manfacture
US5789766A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1997 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Mar 20, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/10
Abstract
A method of fabricating an LED array and stacked driving circuitry includes sequentially forming layers of material on the surface of a substrate, the layers cooperating to emit light when activated. An insulating layer is positioned on the layers and divided into LEDs arranged in an array of rows and columns. Row and column driver circuits are formed on the insulating layer overlying the array by patterning portions of recrystallized amorphous silicon on the insulating layer, depositing a gate insulator layer and a gate metal layer on each of the portions to form an MOS gate, implanting a source and drain in each of the portions, using the MOS gate as a self-aligned mask, and forming contacts for the power terminals and the MOS gate, and coupling each LED in the array to the row and column driver circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.