Position sensor housing having duroplastic molding compound and thermoplastic molding compound
US5789920A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 2, 1996 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Apr 2, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/752
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A sensor and process for manufacturing same having an electrical circuit arranged on a carrier which is connected to an electrical connector and a sensor element. The carrier is disposed within a housing having one opening for the connector element and another opening for the sensor element. The sensor element and a first part of the carrier with the electrical circuit are embedded in a duroplastic molding compound. A second part of the carrier with the electrical circuit and the electrical connector are enclosed by a thermoplastic molding compound. A seal is arranged adjacent an intermediate space between the duroplastic molding compound and the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.