Integral copper column with solder bump flip chip
US5790377A · kind A · utility
114Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1996 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Sep 12, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0367
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention includes an integral copper column with a solder bump flip chip. An integrated circuit chip is provided having an electrical circuit and including at least two contact pads. A thin layer of barrier metallization is provided over the contact pads. A support substrate is provided having a circuit layer with raised features that include copper traces. A solder bump connects the contact pad on the integrated circuit chip and the raised features of the flex circuit to provide an integral copper column with a solder bump flip chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.