Method for obtaining three-dimensional data from semiconductor devices in a row/column array and control of manufacturing of same with data to eliminate manufacturing errors
US5793051A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1996 |
| Grant date | Aug 11, 1998 |
| Priority date | — |
| Expiry date | Aug 12, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0813
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and arrangements are provided to efficiently use 3-D vision systems to measure selected features, of objects that are semi-constrained in compartmented trays having a uniform geometric arrangement. The methods are particularly well suited for optimizing the 3-D measurement of leads on integrated circuit devices which are packaged in trays. For obtaining the three-dimensional data, a multi-pocketed tray can be provided with tray pockets arranged in rows and columns, and corresponding sides of the multiple parts or devices in a row or column are scanned sequentially with at least one three dimensional sensor. This scanning procedure is repeated for all rows and columns containing sides of the devices from which data is to be obtained. The devices can be first aligned by applying directional vibration to the tray to drive all the parts or devices to the same corner or side of the respective pockets. The collected device geometry data is fed back to the manufacturing operation to control the parameters thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.