Method and apparatus for interconnection of multiple modules
US5793998A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1996 |
| Grant date | Aug 11, 1998 |
| Priority date | — |
| Expiry date | Apr 17, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F13/4095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computer system includes a housing, a motherboard, a first module and a second module. An electrical connector on the motherboard is joined to and in electrical communication with an electrical connector on one of two opposing surfaces of the first module, and an electrical connector on the second module is joined to and in electrical communication with another electrical connector on the other of the opposing surfaces of the first module. An electrically conductive path connects the two electrical connectors on the opposing surfaces of the first module. The motherboard transmits electrical signals corresponding to a module identifier to the first module through the motherboard's joined electrical connector. An electrical device on the first module in the electrically conductive path modifies the electrical signals so that they correspond to a second module identifier. The modified electrical signals corresponding to the second module identifier are transmitted to the second module via the electrically conductive path through the electrical connector on the first module that is joined to the electrical connector on the second module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.