Cooling device for hard to access non-coplanar circuit chips
US5794454A · kind A · utility
43Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1996 |
| Grant date | Aug 18, 1998 |
| Priority date | — |
| Expiry date | Dec 4, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Heat pipes are employed in conjunction with flexible flap thermal conductors to provide a mechanism for cooling high-powered electronic circuit chip modules which cannot otherwise be cooled by conventional means because of their non-coplanarity and their inaccessibility. More particularly, the present invention provides a mechanism for cooling electronic circuit chip modules which are disposed on circuit boards which are in close proximity to one another which fact precludes air cooling of heat sink structures and/or the imposition of a liquid-cooled cold plate due to the non-coplanarity and/or due to the inaccessibility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.