Microelectronic component fabrication facility, and process for making and using the facility
US5795356A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 31, 1996 |
| Grant date | Aug 18, 1998 |
| Priority date | — |
| Expiry date | May 31, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing microelectronic components that can be fabricated in a facility 1 including integrated circuits on silicon wafers, flat panel displays on glass substrates or any other microelectronic components fabricated in a similar fashion, a process of constructing the facility, and the facility. The fabrication facility 1 relies on a central hub 3 from which processing areas 2 extend out radially like spokes. The processing areas 2 are arranged in a pattern so as to be served by common services which include gases, chemicals, ultra pure water, vapor exhaust, liquid waste, air conditioning, centralized vacuum, centralized clean compressed air, hot water, steam, natural gas, power including emergency, conditioned, and unconditioned power, and process cooling water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.