Method for removal of films from metal surfaces using electrolysis and cavitation action
US5795460A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1996 |
| Grant date | Aug 18, 1998 |
| Priority date | — |
| Expiry date | Apr 10, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F3/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To remove films, such as oxides and lubricants, from a metal substrate, mechanical or thermal stress is first applied to the films so as to rupture the film to the substrate. The substrate is then moved through an electrolysis cell having one or more electrode elements of one electrical polarity spaced from the moving substrate defining another electrode element with the opposite polarity. An electrical signal is applied to the electrodes, and the electrical signal flows down to the metal substrate, resulting in an etching or pitting of the surface of the metal substrate. Following the electrolysis cell, the moving substrate is immersed in a cavitation fluid. Energy, either sonic or ultrasonic, is generated and focused onto the moving substrate so that cavitation bubbles are formed in the pitted portions of the metal substrate beneath the film. When the cavitation bubbles expand and collapse, the resulting cavitational shock wave and the microjet action produce a lifting effect on the film relative to the metal substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.