Cantilevered microstructure
US5796152A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1997 |
| Grant date | Aug 18, 1998 |
| Priority date | — |
| Expiry date | Jan 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2061/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A cantilever microstructure includes a cantilever arm with a proximal end connected to a substrate and a freely movable distal end. The cantilever arm comprises first and second sections and includes a continuous layer which exhibits a first thermal co-efficient of expansion (TCE). In one embodiment, an electrical contact is positioned at the distal end of the cantilever arm. A first layer is positioned on a surface of the continuous layer and along the first section thereof. The first layer exhibits a second TCE which is different from the first TCE of the continuous layer. A second layer is positioned on a surface of the continuous layer and along the second section thereof. The second layer exhibits a third TCE which is different from the first TCE of the continuous layer. Electrical control circuitry selectively applies signals to the first and second layers to cause a heating thereof and a flexure of the cantilever arm so as to bring the distal end thereof into contact with a conductive substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.