Exposure apparatus and device manufacturing method using the same
US5796469A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 14, 1997 |
| Grant date | Aug 18, 1998 |
| Priority date | — |
| Expiry date | Jul 14, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/70
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An exposure apparatus in which a portion of a pattern of a reticle is projected onto a wafer and in which the reticle and the wafer are scanned synchronously such that the pattern of the reticle is transferred to the wafer. The apparatus includes a reticle stage and a wafer stage for scanningly moving the reticle and the wafer, respectively, a measuring system for measuring a deviation of the reticle stage relative to the wafer stage in a predetermined direction other than the direction of scanning movement, and an adjusting device for adjusting the wafer stage on the basis of the measurement by the measuring system. In one aspect, the measuring system includes a laser interferometer. In another aspect, a frame member is provided for supporting the stages, and a flow passageway is provided in the frame member for flowing therethrough a temperature adjusting medium. In yet another aspect, the present invention is directed to an exposure method for the manufacture of microdevices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.