Printed circut board with embedded decoupling capacitance and method for producing same
US5796587A · kind A · utility
59Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1996 |
| Grant date | Aug 18, 1998 |
| Priority date | — |
| Expiry date | Jun 12, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.