Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
US5796590A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 5, 1996 |
| Grant date | Aug 18, 1998 |
| Priority date | — |
| Expiry date | Nov 5, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for surface-mounting ball grid array integrated circuit (IC) devices to printed circuit boards. A thin single- or multi-layer sheet of nonconductive material having a plurality of apertures corresponding to the leads of the IC device to be mounted is interposed between the ball grid array and the circuit board prior to solder processing to facilitate solder application, device alignment, and solder retention. An assembly guide is located on the top surface of the aid to assist in the orientation and placement of the IC device during assembly. In a further aspect, the disclosed assembly aid helps compensate for non-planarity in the IC device array or circuit board, and maintains a minimum standoff distance between the IC package and the circuit board to preclude undue solder joint deformation. The assembly aid also allows for reworking of the surface mount by facilitating localized placement of the solder prior to reflow processing without masking or other additional processing steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.