Process for depositing optical thin films on both planar and non-planar substrates
US5798027A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1994 |
| Grant date | Aug 25, 1998 |
| Priority date | — |
| Expiry date | Jul 7, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/562
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A rotary cylindrical sputtering system incorporates separate, separately-controlled linear magnetron sputter deposition and reaction zones for sputter depositing materials such as refractory metals and forming oxides and other compounds and alloys of such materials. In one aspect, the associated process involves rotating or translating workpieces past the differentially pumped, atmospherically separated, sequentially or simultaneously operated deposition and reaction zones and is characterized by the ability to form a wide range of materials, by high throughput, and by the ability to form durable optical quality thin films of nominal refractive indices and controlled coating thickness, including both constant and selectively varied thickness profiles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.