Method for integrating microelectromechanical devices with electronic circuitry
US5798283A · kind A · utility
122Cited by
17References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 1995 |
| Grant date | Aug 25, 1998 |
| Priority date | — |
| Expiry date | Sep 6, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0828
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.