Adhesive bonding using variable frequency microwave energy
US5798395A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Mar 29, 1996 |
| Grant date | Aug 25, 1998 |
| Priority date | — |
| Expiry date | Mar 29, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B40/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.