Sensor and method of fabrication
US5798556A · kind A · utility
9Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1996 |
| Grant date | Aug 25, 1998 |
| Priority date | — |
| Expiry date | Mar 25, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/0014
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor (10) includes a cavity (31) formed by a substrate (11), an adhesive (21), and a filter (22). A sensing element (14) is located inside the cavity (31) while electrical contacts (17, 18) coupled to the sensing element (14) are located outside the cavity (31). The filter (22) protects the sensing element (14) from physical damage and contamination during die singulation and other assembly processes. The filter (22) also improves the chemical sensitivity, selectivity, response times, and refresh times of the sensing element (14).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.