Ceramic IC package base and ceramic cover
US5798566A · kind A · utility
18Cited by
5References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1997 |
| Grant date | Aug 25, 1998 |
| Priority date | — |
| Expiry date | Nov 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with the present invention, there is provided a ceramic IC package base which comprises a ceramic substrate, and a heat radiating member adhered to a side surface of the ceramic substrate and made of copper or copper alloy. The heat radiating member has an adhering portion at which it is adhered to the ceramic substrate. The adhering portion, when the heat radiating member is observed in a plan view, has one side which is equal to or larger than 8 mm. The adhering portion is of the thickness within the range from 0.25 mm to 0.76 mm. A ceramic IC package cover is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.