Method for producing a plated-through hole on a printed-circuit board
US5799393A · kind A · utility
7Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1996 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Sep 23, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a plated-through hole on a printed-circuit board, whereby the printed-circuit board is initially bored, catalyzed, and patterned. The plated-through hole is then fashioned in an electrochemical deposition process so as to make it functional for the through-hole mounting of electrical components. The plating process is preferably carried out with nickel or nickel compounds, so that no additional corrosion protection is required. A direct bonding to the contact lands can be achieved by coating the contact lands with gold or palladium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.