Copper alloy mold for casting aluminum or aluminum alloy
US5799717A · kind A · utility
8Cited by
4References
9Claims
0Family size
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Inventors
Key dates
| Filing date | Nov 15, 1996 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Nov 15, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C2/06
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A mold for casting aluminum or aluminum alloy made of a copper alloy having a thermal conductivity of not less than 0.20 cal/s.cndot.cm.degree.C. The mold cavity surface is locally or entirely formed with a coated layer. The coated layer may be either (i) a cermet layer including of at least one element selected from the group consisting of Co, Cu, Cr and Ni, or (ii) a Co--, Ni--, Cr --or Mo-based hard alloy layer. The copper alloy mold exhibits distinguished thermal conductivity and resistance to melt damages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.