High density electrical interconnect apparatus and method
US5800184A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1995 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Dec 11, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection. More particularly, the invention encompasses an apparatus that is used as a temporary media between a chip, module, card, etc., that needs to be tested and/or burned-in and a test or burn-in system. A method for such burn-in and/or test or electrical interconnection is also disclosed. The invention also encompasses an apparatus and a method that can be used as a permanent media between two electrical devices, such as, for example, between a chip and a module or a card, etc., that is to be contained in and part of a system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.