Automatic apparatus for grinding and polishing samples
US5800254A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1996 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Apr 1, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An automatic sample preparation system for polishing and grinding metallurgical and other samples prior to microscopic examination of the samples, including a rack which holds a plurality of abrasive platens, and platen transfer mechanism for selecting one platen from the rack and transferring the same to a platen drive plate for a polishing operation and for later returning the platen to the rack and transferring another selected platen to the platen drive plate, and a polishing head which can be rotated between a polishing position for polishing samples and a wash position where it is over a wash and dry station, the platen transfer mechanism being operated when the polishing head is rotated to its wash position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.