Method for producing data carriers with embedded elements
US5800763A · kind A · utility
22Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1995 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Sep 28, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The card body of a data carrier with elements disposed therein, for example an electronic module, is produced from a pressed molding compound in a pressing apparatus. The elements to be embedded in the card body are preferably incorporated in the pressing apparatus and positioned and fixed there before the pressing operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.