Nodular copper/nickel alloy treatment for copper foil
US5800930A · kind A · utility
38Cited by
31References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1997 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Jun 24, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There it is disclosed a chemical treatment for copper foil which imparts a dark brown to black color to the foil and improves the bond strength of the foil to a dielectric substrate without detrimentally changing the etching characteristics of the foil. The treatment includes depositing a nodular copper/nickel alloy layer on a surface of the foil. These nodules are 55% to 95% by weight copper and are electrolytically deposited using a pulse power controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.