Method of making two-component nanospheres and their use as a low dielectric constant material for semiconductor devices
US5801092A · kind A · utility
Inventor
Key dates
| Filing date | Sep 4, 1997 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Sep 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1047
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention provides a process for making an insulation layer for use in microelectronic devices, whereby capacitive coupling and propagation delay in the microelectronic devices are reduced. This invention can include the formation of a stable solution of spherical particles consisting of a ceramic core 10 and a non-polar coating 20. This solution can be applied to an microelectronic substrate, and dried to form a continuous, porous layer. Novel methods are disclosed for bonding these particles together into an integral layer. Porous layers formed by the process of this invention possess a very low dielectric constant, and can be produced using equipment and techniques common and available to those skilled in the art of microelectronic fabrication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.